Kyle E. Yazzie: search on Z-Library

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1

Mechanical Characterization of Thermal Interface Materials and its Challenges

Subramanian, Vijay, Sanchez, Jorge, Bautista, Joseph, He, Yi, Wang, Jinlin, Das, Abhishek, Schuldes, Jesus Gerardo Reyes, Yazzie, Kyle, Dhavaleswarapu, Dr. Hemanth K., Malatkar, Pramod

Journal:

Journal of Electronic Packaging

Year:

2019

Language:

english

File:

PDF, 2.36 MB

english, 2019

2

On the Correlation Between Fatigue Striation Spacing and Crack Growth Rate: A Three-Dimensional (3-D) X-ray Synchrotron Tomography Study

Jason J. Williams, Kyle E. Yazzie, N. Connor Phillips, Nikhilesh Chawla, Xinghui Xiao, Francesco De Carlo, Nagaraja Iyyer, Maddan Kittur

Journal:

Metallurgical and Materials Transactions A

Year:

2011

Language:

english

File:

PDF, 523 KB

english, 2011

3

Characterization of Bulk and Thin Film Fracture in Electronic Packaging

Subramanian, Vijay, Yazzie, Kyle, Alazar, Tsgereda, Penmecha, Bharat, Liu, Pilin, Bai, Yiqun, Malatkar, Pramod

Journal:

Journal of Electronic Packaging

Year:

2017

Language:

english

File:

PDF, 1.19 MB

english, 2017

4

High-Temperature Interfacial Adhesion Strength Measurement in Electronic Packaging Using the Double Cantilever Beam Method

Sankarasubramanian, Santosh, Cruz, Jaime, Yazzie, Kyle, Sundar, Vaasavi, Subramanian, Vijay, Alazar, Tsgereda, Yagnamurthy, Sivakumar, Cetegen, Edvin, McCoy, David, Malatkar, Pramod

Journal:

Journal of Electronic Packaging

Year:

2017

Language:

english

File:

PDF, 4.64 MB

english, 2017

5

Finite element simulation of swelling-induced crack healing in gels

Zhang, Jiaping, An, Yonghao, Yazzie, Kyle, Chawla, Nikhilesh, Jiang, Hanqing

Journal:

Year:

2012

Language:

english

File:

PDF, 749 KB

english, 2012

6

Multiscale Modeling of the Interfacial Fracture Behavior in the Sn–Cu6 Sn5–Cu System

Fei, Huiyang, Yazzie, Kyle, Williams, Jason, Chawla, Nikhilesh, Jiang, Hanqing

Journal:

Journal of Computational and Theoretical Nanoscience

Year:

2011

Language:

english

File:

PDF, 6.92 MB

english, 2011

7

[IEEE 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2015.5.26-2015.5.29)] 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - On the effective coefficient of thermal expansion (CTE) of bilayer/trilayer in semiconductor package substrates

Chen, Peng, Raghavan, Prasanna, Yazzie, Kyle, Fei, Huiyang

Year:

2015

Language:

english

File:

PDF, 772 KB

english, 2015

8

[ASME ASME 2016 International Mechanical Engineering Congress and Exposition - Phoenix, Arizona, USA (Friday 11 November 2016)] Volume 10: Micro- and Nano-Systems Engineering and Packaging - High Temperature Interfacial Adhesion Strength Measurement in Electronic Packaging Using the Double Cantilever Beam Method

Sankarasubramanian, Santosh, Cruz, Jaime, Yazzie, Kyle, Sundar, Vaasavi, Subramanian, Vijay, Cetegen, Edvin, McCoy, David, Malatkar, Pramod

Year:

2016

Language:

english

File:

PDF, 1.53 MB

english, 2016

9

[ASME ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels - San Francisco, California, USA (Monday 6 July 2015)] Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays - Thermal-Mechanical Impact of Thermal Solutions in Handheld Devices

Harirchian, Tannaz, Liang, Zuyang Frank, Yazzie, Kyle, Schroeder, Michael A., Gupta, Ashish, Mcallister, Alan C.

Year:

2015

Language:

english

File:

PDF, 2.32 MB

english, 2015

10

Modeling Fracture of Sn-Rich (Pb-Free) Solder Joints Under Mechanical Shock Conditions

Huiyang Fei, Kyle Yazzie, Nikhilesh Chawla, Hanqing Jiang

Journal:

Journal of Electronic Materials

Year:

2012

Language:

english

File:

PDF, 1.60 MB

english, 2012

11

The Effect of Random Voids in the Modified Gurson Model

Huiyang Fei, Kyle Yazzie, Nikhilesh Chawla, Hanqing Jiang

Journal:

Journal of Electronic Materials

Year:

2012

Language:

english

File:

PDF, 1.65 MB

english, 2012

12

On the Asymmetric Growth Behavior of Intermetallic Compound Layers During Extended Reflow of Sn-Rich Alloy on Cu

Kyle E. Yazzie, Jonathan Topliff…

Journal:

Metallurgical and Materials Transactions A

Year:

2012

Language:

english

File:

PDF, 501 KB

english, 2012

13

[ASME ASME 2016 International Mechanical Engineering Congress and Exposition - Phoenix, Arizona, USA (Friday 11 November 2016)] Volume 10: Micro- and Nano-Systems Engineering and Packaging - Characterization of Bulk and Thin Film Fracture in Electronic Packaging

Subramanian, Vijay, Alazar, Tsgereda, Yazzie, Kyle, Penmecha, Bharat, Liu, Pilin, Bai, Yiqun, Malatkar, Pramod

Year:

2016

Language:

english

File:

PDF, 1.94 MB

english, 2016

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